IBM substrates at 170% - IBM will detail a technique at the upcoming Symposium on VLSI Technology in Kyoto, Japan, next week regarding a new substrate manufacturing process whereby silicon atoms are forced into alignment further apart than would naturally occur under other processes. This process, called "straining," alters the substrate resistance, allowing electrons to flow faster and more easily. IBM engineers claim electrons can move up to 70% more quickly, thereby reducing overall power consumption and speeding up processing. This technology should be commercially available in 2003. - submitted by Rick C. Hodgin www.chipgeek.com (http://www.chipgeek.com)

It is amazing to think that we've no where reached a bottle neck in speed or ability. I just wonder where the future will be as far as programs that require so much power.

10GHz here we come! (Intel believes they 2004-2005 to have a 10GHz module)

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Manu Narayan

Yeah, but when will technology become advanced enough to play Ultima IX without chop?

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"Who are you?"
"The devil," she said. "The devil in love."